Exynos 2600 has a new innovation that’s attracting Apple and Qualcomm

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The Exynos 2600 not only does the heavily lifting of powering Samsung's next flagship series, it also serves as a proof of concept for Samsung's 2nm chipmaking capabilities. The company needs this chipset to draw in major customers for its 2nm process.



A new report from South Korea highlights an innovation that Samsung has created for the Exynos 2600 that's reportedly generating interest from the likes of Apple and Qualcomm.



It improves thermals by as much as 30%



Samsung Foundry has reportedly developed a “Heat Path Block” technology to counter the consistent thermal issues its previous flagship chipsets have faced. Samsung has since developed this semiconductor heat suppressing technology to reduce thermal impact and increase performance.



This Heat Path Block technology involves a copper heatsink that is packaged on top of a mobile AP. It enhances heat dissipation by moving the DRAM to the side, with a report claiming that an up to 30% improvement in thermals is observed in the Exynos 2600 compared to its predecessor.



Qualcomm and Apple have primarily been getting their chips made at TSMC. Samsung largely missed out on the 3nm demand as its process didn't inspire much confidence among the top players. Samsung is cautiously optimistic for its 2nm process which it feels has the ability to draw in those customers.



If the Exynos 2600 is able to deliver the performance and thermal figures that Samsung hopes it would, then it may go a long way in giving those customers the peace of mind that Samsung's 2nm process is fully capable of addressing their chipmaking needs.


The post Exynos 2600 has a new innovation that’s attracting Apple and Qualcomm appeared first on SamMobile.



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